3DBODY.TECH 2019 - Paper 19.119

J. Siegmund et al., "Development of a 3D Grading Method for Shoe Lasts Based on Scanned 3D Foot Data", in Proc. of 3DBODY.TECH 2019 - 10th Int. Conf. and Exh. on 3D Body Scanning and Processing Technologies, Lugano, Switzerland, 22-23 Oct. 2019, pp. 119-124, doi:10.15221/19.119.

Title:

Development of a 3D Grading Method for Shoe Lasts Based on Scanned 3D Foot Data

Authors:

Jana SIEGMUND, Huangmei LIN, Sybille KRZYWINSKI, Monika RICHTER, Kathrin SCHAEFER

1 TU Dresden, Institute of Textile Machinery and High Performance Material Technology, Germany;
2 Pruef- und Forschungsinstitut Pirmasens e. V., Pirmasens, Germany

Abstract:

In the shoe manufacturing sector, products are typically designed for a small number of sample sizes, whereas all other shoe sizes in the range (for example, 2 to 4 shoe sizes below and above) are scaled using grading methods. However, the grading process significantly affects the fit and thus consumer acceptance. In this context, the shoe last forms the basis for all additional components to be used, such as insoles, midsoles, outsoles and heels. The entire shaft construction is based on the last as well. It also determines the fit of shoes. However, a method once established in the 1930s and still used today for the grading of shoe lasts is limited to only two dimensions, i.e. last length and technical ball circumference. The entire last is enlarged or reduced on the basis of these dimensions. The 3D CAD systems available today still employ the principle of mechanical last copying based on machines from the 1930s. Thus, the technical potential of these CAD systems is far from exhausted.
An innovative grading process allows shoe companies to better utilize and significantly expand the performance potential and technical capabilities of their 3D CAD systems. As the required amount of manual work in preparation for grading and last generation is considerably decreased, development times are shortened.

Details:

Full paper: 19119siegmund.pdf
Proceedings: 3DBODY.TECH 2019, 22-23 Oct. 2019, Lugano, Switzerland
Pages: 119-124
DOI: 10.15221/19.119

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